滚球体育Thermoelectric Cooling Solutions

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滚球体育Thermoelectric coolers

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MD015 SERIES OF SINGLE TE MODULES

The MD015 Series consists of thermoelectric cooler based on RMT SuperHD pellets placement technology. MD015 TECs have a combination of a miniature cross section of pellets and a distance of 100 渭m between them. This allows the density of 1600 elements per 1 cm2. The result is 鈥 unique miniature thermoelectric coolers with low current, low energy consumption and operating voltage, optimal for the best power supply efficiency. TE modules of the 1MD015 Series have planar dimensions less than 1,5 mm2 and height 0,55 mm and lower. MD015 TECs meet high performance requirements of transceiver components with low power consumption. MD015 Series is recommended for TO-can TOSA transceivers, VCSELs and miniature LD-applications in small form factors (TO46 and TO56 and smaller). AlN ceramics is applied by default, Al2O3 ceramics is available as an option.

MD015 Series have the highest level of bulk thermoelectric coolers miniaturization. MD015 TECs are developed by RMT mainly for cooling and temperature stabilization of telecommunication miniature systems.

Fig.1 - 1x1 mm2 cold side thermoelectric cooler - the smallest one from MD015 Series Fig.2 - 1MD015-010-025AN SEM photo. 20 BiTe pellets on 1x1.6 mm2 size Fig.3 - TE module 1MD015-010-03 mounted on 孝袨-46 header


滚球体育Thermoelectric coolers MD015 Series

SPECIFICATIONS

Exterior

Type

dTmax
K

Qmax
W

Imax
A

Umax
V

ACR
Ohm

H
mm

A
mm

B
mm

C
mm

D
mm

DataSheet

Performance table at 27C, vacuum

1MD015-008-XX (N=8)

1MD015-008-025

67

0.27

0.45

1.0

1.77

0.5

1.0

1.0

1.0

1.4

Datasheet

1MD015-008-03

69

0.22

0.35

2.12

0.55

1MD015-010-XX (N=10)

1MD015-010-025

67

0.34

0.45

1.25

2.21

0.5

1.0

1.3

1.0

1.6

Datasheet

1MD015-010-03

69

0.28

0.35

2.65

0.55

1MD015-018-XX (N=18)

1MD015-018-025

67

0.60

0.45

2.3

3.98

0.5

1.5

1.5

1.5

1.9

Datasheet

1MD015-018-03

69

0.50

0.35

4.77

0.55

1MD015-027-XX (N=27)

1MD015-027-025

67

0.91

0.45

3.4

5.97

0.5

1.6

2.3

1.6

2.9

Datasheet

1MD015-027-03

69

0.75

0.35

7.16

0.55

1MD015-032-XX (N=32)

1MD015-032-025

66

1.07

0.45

4.0

7.08

0.5

2.0

2.0

2.0

2.4

Datasheet

1MD015-032-03

69

0.89

0.35

8.48

0.55


Performance table at 50C, N2

1MD015-008-XX (N=8)

1MD015-008-025

72

0.29

0.45

1.1

1.99

0.5

1.0

1.0

1.0

1.4

Datasheet

1MD015-008-03

74

0.24

0.35

2.39

0.55

1MD015-010-XX (N=10)

1MD015-010-025

72

0.35

0.45

1.4

2.49

0.5

1.0

1.3

1.0

1.6

Datasheet

1MD015-010-03

74

0.3

0.35

2.98

0.55

1MD015-018-XX (N=18)

1MD015-018-025

72

0.66

0.45

2.5

4.48

0.5

1.5

1.5

1.5

1.9

Datasheet

1MD015-018-03

74

0.55

0.35

5.37

0.55

1MD015-027-XX (N=27)

1MD015-027-025

72

1.00

0.45

3.75

6.72

0.5

1.6

2.3

1.6

2.9

Datasheet

1MD015-027-03

74

0.80

0.35

8.06

0.55

1MD015-032-XX (N=32)

1MD015-032-025

72

1.17

0.42

4.5

7.97

0.5

2.0

2.0

2.0

2.4

Datasheet

1MD015-032-03

74

0.98

0.35

9.55

0.55

Important Note: MD015 Series TECs are manufactured by default on 0.1 mm thickness AlN ceramics. There is also 0.15mm ceramics as a solution for low-height thermoelectric coolers. This adds an additional flexibility to performance and height optimization in a particular application. It is also possible to combine various ceramics thicknesses to achieve the most optimal results for TEC height.

Please, use On-Line Assistant to find the most optimal thermoelectric cooler by dimensions and performance parameters. The detailed analysis of TEC performance and power consumption can be made with free TECCad software for Windows

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Definition and Notes

 

Perfomance Plots

How to Select ...

 

Standart Options

 

OPTIONS

      A.    TEC Assembly Solder
1.     Lead-free Solder Sn-Sb (Tmelt =230潞C) 鈥 default
2.     Lead-free Solder Au-Sn (Tmelt = 280潞C) available by request

B.    Ceramics

1.     Aluminum Nitride (AIN) - default
2.     Al2O3 100%
3.     Mixed solution (AlN/Al2O3)

 

                                        

C.    Surface finish

1.     Blank ceramics (not metallized) 
2.     Metallized (Au plating)

D.    Thermistor (optional)

Can be mounted to TEC cold side. Calibration is available by request. Various thermistor solutions are available

E.    TEC Terminal contacts:

1.     WB pads or WB posts
2.     Flip-Chip Terminal Solution


Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.